Multicore TFN600
Tacky flux which provides excellent moisture and environmental protection for delicate circuitry in handheld devices.Non-Newtonian tacky flux designed for solder sphere attach in BGAs and CSPs. The rheology has been for diverse ball attach processes where the flux can be printed, dispensed or delivered by pin-transffer. Provides effective reliability in the attachment of Pb-free solder spheres to both Copper and gold / nickel based ubm packages.
Multicore TFN600
Tacky flux which provides excellent moisture and environmental protection for delicate circuitry in handheld devices.Non-Newtonian tacky flux designed for solder sphere attach in BGAs and CSPs. The rheology has been for diverse ball attach processes where the flux can be printed, dispensed or delivered by pin-transffer. Provides effective reliability in the attachment of Pb-free solder spheres to both Copper and gold / nickel based ubm packages.
