MULTICORE HF208
MULTICORE HF208 is a halogen-free, no clean, low voiding Pb-free solder paste. It shows excellent humidity resistance and solderability when reflowed in both air and nitrogen across a wide range of surface finishes including OSP copper.
MULTICORE HF208
MULTICORE HF208 is a halogen-free, no clean, low voiding Pb-free solder paste. It shows excellent humidity resistance and solderability when reflowed in both air and nitrogen across a wide range of surface finishes including OSP copper.
